Techworks acknowledges the governments publication of its long-awaited semiconductor strategy
The UK Government has released the following statement regarding the National Semiconductor Strategy
WAE announces a strategic equity investment in Beam Connectivity Ltd, supporting the commercialisation of connected vehicle Systems
Beam Connectivity are pioneers in connected vehicle systems and have developed a high performance, versatile and secure end-to-end connected vehicle solution.
McLaren Applied selects STMicroelectronics to supply silicon carbide power modules
ST Microelectronics joins as a key supplier of silicon carbide (SiC) power modules for McLarens next-generation IPG5 800V inverter.
Nexperia introduces in-vehicle network ESD protection portfolio for 24 V board net systems
Nexperia today introduced an AEC-Q101 qualified portfolio with six ESD protection devices (PESD2CANFD36XX-Q) designed to protect bus lines in automotive in-vehicle networks (IVN) such as LIN, CAN, CAN-FD, FlexRay and SENT from damage caused by electrostatic discharge (ESD) and other transients.
Advanced Propulsion Centre release two new Power Electronics Reports
Developed by the APC, with experts and stakeholders from industry, academia and funding and support bodies, the updated power electronics value chain shows an end-to-end supply chain view of materials and components required for volume manufacturing of automotive inverters, converters, and onboard chargers.
Triumph’s TE-1 Wins Electric Motorcycle of the Year
With a throttle action and torque delivery map directly engineered from a Speed Triple 1200 RS, the track testing and dynamic rider assessments of the TE-1 prototype demonstrator deliver a level of handling that matches Triumph’s current triple cylinder internal combustion sports performance motorcycles.
Automotive IC shortage to last till 2024 according to Sourcengine
ElectronicsWeekly reports on the global shortage and current lead times for components from a number of manufacturers.
TechWorks appoints Charles Sturman as CEO
TechWorks, the UK’s Industry Association for deep tech connected communities has announced the appointment of Charles Sturman as CEO effective from 1st March 2023.
NMI member, Clas-SiC Wafer Fab, are the cover story in this months Compound Semiconductor magazine
NMI member, Clas-Sic Wafer Fab, discuss their history, future plans, company philosophy, product line and the challenges of not being a startup, but instead restarting from the ground up with a new facility.
The Advanced Propulsion Centre’s next wave of its Technology Developer Accelerator Programme (TDAP) is now open for Expressions of Interest (EOI).
Wave 7 of the Technology Developer Accelerator Programme (TDAP) offers up to £170,000 of grant support to ambitious micro, small and medium-sized enterprises.